Method for fabricating an integrated circuit device

ABSTRACT

A method for fabricating an integrated circuit device is disclosed. A substrate is provided and an integrated circuit area is formed on the substrate. The integrated circuit area includes a dielectric stack. A seal ring is formed in the dielectric stack and around a periphery of the integrated circuit area. A trench is formed around the seal ring and exposing a sidewall of the dielectric stack. The trench is formed within a scribe line. A moisture blocking layer is formed on the sidewall of the dielectric stack, thereby sealing a boundary between two adjacent dielectric films in the dielectric stack.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.16/886,721 filed May 28, 2020, which is included in its entirety hereinby reference.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to the field of semiconductor technology,and in particular to an improved integrated circuit device and a methodof manufacturing the same.

2. Description of the Prior Art

Seal ring formation is an important part in the back-end ofsemiconductor processes. Seal rings are stress protection structuresaround integrated circuits, protecting the internal circuit insidesemiconductor chips from damage caused by the dicing of thesemiconductor chips from wafers.

Another function of the seal ring is to protect the integrated circuitson the inner side of seal ring from moisture-induced degradation. Sincedielectric layers of the integrated circuits are typically formed ofporous low-k dielectric materials, moisture can easily penetrate throughlow-k dielectric layer to reach the integrated circuits.

Conventional seal rings are electrically continuous around the peripheryof a die, and the direct electrical path around the periphery of the diecan transfer noise to sensitive analog and RF blocks, which isundesirable. One conventional solution to prevent noise transfer is theuse of electrically discontinuous seal ring, thereby inhibiting asignificant portion of the noise transfer. However, the discontinuitiesof the seal ring allow for penetration of the semiconductor die byharmful moisture and other contaminants.

SUMMARY OF THE INVENTION

One object of the present invention is to provide a method forfabricating an improved integrated circuit device to solve theabove-mentioned shortcomings of the prior art.

One aspect of the invention provides a method for fabricating anintegrated circuit device. A substrate is provided and an integratedcircuit area is formed on the substrate. The integrated circuit areaincludes a dielectric stack. A seal ring is formed in the dielectricstack and around a periphery of the integrated circuit area. A cap layeris formed on the dielectric stack. A trench is formed around the sealring to expose a sidewall of the dielectric stack. Ametal-insulator-metal (MIM) capacitor including a capacitor top metal(CTM) layer and a capacitor bottom metal (CBM) layer is disposed on thedielectric stack. A moisture blocking layer is formed to continuouslycover the integrated circuit area and the MIM capacitor. The cap layeris interposed between the CTM layer and the CBM layer of the MIMcapacitor and functions as a capacitor dielectric layer of the MIMcapacitor. The moisture blocking layer extends to the sidewall of thedielectric stack, thereby sealing a boundary between two adjacentdielectric films in the dielectric stack. A passivation layer is formedover the moisture blocking layer.

According to some embodiments, the integrated circuit area comprises aradio-frequency (RF) circuit region.

According to some embodiments, the substrate is a silicon-on-insulator(SOI) substrate comprising a lower substrate, a buried oxide layer onthe lower substrate, and a device layer on the buried oxide layer.

According to some embodiments, the device layer comprises a siliconlayer.

According to some embodiments, the seal ring is electrically coupled tothe lower substrate with a through contact that penetrates through thedevice layer and the buried oxide layer.

According to some embodiments, the two adjacent dielectric films are twoadjacent low-dielectric constant (low-k) dielectric films.

According to some embodiments, the seal ring is a discontinuous sealring.

According to some embodiments, the seal ring is composed ofinterconnected metal lines and vias.

According to some embodiments, the metal lines comprise a topmost coppermetal layer.

According to some embodiments, the topmost copper metal layer is atopmost damascene copper layer, and wherein the CBM layer is coplanarwith the topmost damascene copper layer.

According to some embodiments, a topmost inter-layer dielectric (ILD)film is formed to cover the moisture blocking layer and the MIMcapacitor. A topmost via layer penetrates through the topmost ILD filmand the moisture blocking layer to electrically connect with the topmostcopper metal layer. An aluminum pad is disposed on and electricallyconnected to the topmost via layer.

According to some embodiments, the passivation layer covers a peripheryof the aluminum pad and a top surface of the topmost ILD film.

According to some embodiments, the topmost ILD film comprises siliconoxide.

According to some embodiments, the passivation layer comprises polyimideor silicon oxide.

According to some embodiments, the moisture blocking layer comprisessilicon nitride, silicon oxynitride, or silicon carbonitride.

Another aspect of the invention provides a method for fabricating anintegrated circuit device. A substrate is provided and an integratedcircuit area is formed on the substrate. The integrated circuit areaincludes a dielectric stack. A seal ring is formed in the dielectricstack and around a periphery of the integrated circuit area. A trench isformed around the seal ring and exposing a sidewall of the dielectricstack. The trench is formed within a scribe line. A moisture blockinglayer is formed on the sidewall of the dielectric stack, thereby sealinga boundary between two adjacent dielectric films in the dielectricstack. The moisture blocking layer is a composite layer comprising asilicon oxide layer and a silicon nitride layer on the silicon oxidelayer.

According to some embodiments, the integrated circuit area comprises aradio-frequency (RF) circuit.

According to some embodiments, the substrate is a silicon-on-insulator(SOI) substrate comprising a lower substrate, a buried oxide layer onthe lower substrate, and a device layer on the buried oxide layer.

According to some embodiments, the device layer comprises a siliconlayer.

According to some embodiments, the seal ring is electrically coupled tothe lower substrate with a through contact that penetrates through thedevice layer and the buried oxide layer.

According to some embodiments, the two adjacent dielectric films are twoadjacent low-dielectric constant (low-k) dielectric films.

According to some embodiments, the seal ring is a discontinuous sealring.

According to some embodiments, the seal ring is composed ofinterconnected metal lines and vias.

According to some embodiments, the metal lines comprise a topmost coppermetal line.

According to some embodiments, the topmost copper metal line is atopmost damascene copper layer.

According to some embodiments, a topmost dielectric film is formed overthe dielectric stack. A topmost via layer penetrates through the topmostdielectric film to electrically connect with the topmost copper metallayer. An aluminum pad is disposed on and electrically connected to thetopmost via layer.

According to some embodiments, the integrated circuit device furthercomprises a passivation layer covering a periphery of the aluminum padand a top surface of the topmost dielectric film.

According to some embodiments, the topmost dielectric film comprisessilicon oxide.

According to some embodiments, the passivation layer comprises polyimideor silicon oxide.

These and other objectives of the present invention will no doubt becomeobvious to those of ordinary skill in the art after reading thefollowing detailed description of the preferred embodiment that isillustrated in the various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 to FIG. 5 are schematic diagrams showing an exemplary method forforming an integrated circuit device with a seal ring according to anembodiment of the present invention.

FIG. 6 to FIG. 9 are schematic, cross-sectional diagrams showing amethod of fabricating an integrated circuit device with a seal ringaccording to another embodiment of the present invention.

DETAILED DESCRIPTION

In the following detailed description of the disclosure, reference ismade to the accompanying drawings, which form a part hereof, and inwhich is shown, by way of illustration, specific embodiments in whichthe invention may be practiced. These embodiments are described insufficient detail to enable those skilled in the art to practice theinvention.

Other embodiments may be utilized and structural, logical, andelectrical changes may be made without departing from the scope of thepresent invention. Therefore, the following detailed description is notto be considered as limiting, but the embodiments included herein aredefined by the scope of the accompanying claims.

Please refer to FIG. 1 to FIG. 5 . FIG. 1 to FIG. 5 are schematicdiagrams showing an exemplary method for forming an integrated circuitdevice 1 with a seal ring according to an embodiment of the presentinvention. FIG. 1 is a schematic top view of the integrated circuitdevice 1. FIG. 2 to FIG. 5 are cross-sectional views taken along lineI-I′ of FIG. 1 .

As shown in FIG. 1 and FIG. 2 , a substrate 100 such as a semiconductorsubstrate is first provided. For example, the substrate 100 may be asilicon-on-insulator (SOI) substrate, including a lower substrate 101, aburied oxide layer 102 on the lower substrate 101, and a device layer103 on the buried oxide layer 102. The lower substrate 101 may be asilicon substrate, the buried oxide layer 102 may be a silicon oxidelayer, and the device layer 103 may be a silicon layer, for example, asingle crystalline silicon layer.

According to an embodiment of the invention, at least one integratedcircuit area 10 is formed on the substrate 100. For the sake ofsimplicity, two exemplary integrated circuit areas 10 are shown in thefigures. According to an embodiment of the invention, each of the twointegrated circuit areas 10 comprises a radio frequency (RF) circuitregion 11. For the sake of simplicity, the circuit elements and metalinterconnection structure of the integrated circuit areas 10 are notshown in FIG. 2 . According to an embodiment of the invention, a scribeline area 20 is provided between the integrated circuit areas 10.

According to an embodiment of the invention, each integrated circuitarea 10 comprises a dielectric stack 40. According to an embodiment ofthe invention, a structurally and electrically discontinuous sealingring 30 is disposed in the dielectric stack 40, and the sealing ring 30is disposed around the periphery of the integrated circuit area 10. Thesealing ring 30 can protect the RF circuit region 11 from damage causedby wafer sawing. The electrically discontinuous sealing ring 30 cansuppress noise transmission. However, due to the structuraldiscontinuity of the sealing ring 30, its ability to block moisture orcontaminants from penetrating into the RF circuit region 11 is reduced.The present invention addresses this issue.

According to an embodiment of the present invention, as shown in FIG. 2, the dielectric stack 40 has at least two adjacent dielectric films 401and 403 with an interface 402 between the dielectric film 401 and thedielectric film 403. Moisture or stress may penetrate into the RFcircuit region 11 through the interface or boundary 402 between thedielectric film 401 and the dielectric film 403, causing corrosion ordamage to the circuit structure. According to an embodiment of thepresent invention, the two adjacent dielectric films 401 and 403 may betwo adjacent low-k dielectric films.

According to an embodiment of the invention, the sealing ring 30 iscomposed of interconnected metal lines M and vias V. For the sake ofsimplicity, only the first metal layer M1, the second metal layer M2 andthe first via layer V1 between the first metal layer M1 and the secondmetal layer M2 are shown in FIG. 2 . According to an embodiment of thepresent invention, the second metal layer M2 may be the topmost coppermetal layer, for example, the topmost damascened copper metal layer. Inthis exemplary embodiment, the second metal layer M2 and the first vialayer V1 are interconnected structures formed by a dual damascene copperprocess, and there will be no copper interconnects above the secondmetal layer M2.

According to an embodiment of the invention, the sealing ring 30 iselectrically coupled to the lower substrate 101 via a through contact TVpenetrating the device layer 103 and the buried oxide layer 102.According to an embodiment of the invention, the through contact TVpenetrates through the trench isolation region ST provided in the devicelayer 103. According to an embodiment of the invention, after completingthe chemical mechanical polishing (CMP) process of the second metallayer M2, a cap layer 404 such as a silicon nitride layer, siliconoxynitride layer, or silicon carbide layer may be deposited on thesecond metal layer M2 and the dielectric film 403.

According to an embodiment of the invention, the RF circuit region 11comprises a metal-insulator-metal (MIM) capacitor 110. According to anembodiment of the invention, for example, the MIM capacitor 110comprises a capacitor bottom metal (CBM) layer 111 and a capacitor topmetal (CTM) layer 112. According to an embodiment of the invention, forexample, the CBM layer 111 is coplanar with the second metal layer M2.According to an embodiment of the invention, for example, the CTM layer112 may be a titanium or titanium nitride layer, but is not limitedthereto. The cap layer 404 is interposed between the CBM layer 111 andthe CTM layer 112 and functions as the capacitor dielectric layer.

As shown in FIG. 3 , a patterned photoresist layer 410 is then formed onthe second metal layer M2 and the dielectric film 403. According to anembodiment of the invention, the patterned photoresist layer 410 coversthe integrated circuit area 10 and partially exposes the scribe linearea 20. Next, an anisotropic dry etching process is performed to etchaway the dielectric stack 40 that is not covered by the patternedphotoresist layer 410, partially revealing the device layer 103 in thescribe line area 20, thereby forming at least one annular trench R inthe scribe line area 20 around the periphery of the seal ring 30. Thetrench R may have a width of about 1-5 micrometers depending upon theaspect ratio of the metal stack of the seal ring 30. According to anembodiment of the invention, the trench R surrounds the seal ring 30,and the trench R exposes a sidewall 40 a of the dielectric stack 40 andthe interface or boundary 402 between the dielectric film 401 and thedielectric film 403 on the sidewall 40 a.

As shown in FIG. 4 , subsequently, the remaining photoresist layer 410is stripped off. At this point, the cap layer 404 on the dielectricstack 40 is revealed. Next, a moisture blocking layer 405 is formed tocontinuously cover the integrated circuit area 10 and extend onto thesidewall 40 a of the dielectric stack 40, thereby sealing the interface402 between the dielectric films 401 and 403 of the dielectric stack 40.The moisture blocking layer 405 can effectively prevent moisture orcontaminants from penetrating into the RF circuit region 11. Accordingto an embodiment of the invention, the moisture blocking layer 405 maycomprise silicon nitride, silicon oxynitride, or silicon carbonitride.According to an embodiment of the invention, the moisture blocking layer405 not only covers the sidewall 40 a of the dielectric stack 40, butalso extends into the scribe line region 20 and covers the device layer103.

As shown in FIG. 5 , next, a topmost inter-layer dielectric (ILD) film406 is formed to cover the moisture barrier layer 405, the MIM capacitor110, and the dielectric stack 40. The trench R may be completely filledwith the topmost inter-layer dielectric (ILD) film 406 and the moisturebarrier layer 405. According to an embodiment of the invention, thetopmost ILD film 406 may comprise silicon oxide. Next, a topmost vialayer Vn is formed in the topmost ILD film 406. The topmost via layer Vnpenetrates through the topmost ILD film 406, the moisture blocking layer405, and the cap layer 404 to electrically connect with the second metallayer M2. Next, an aluminum pad AP is formed on the topmost ILD film406. The aluminum pad AP is disposed directly on the topmost via layerVn, and is electrically connected to the topmost via layer Vn. Next, apassivation layer PL is deposited to cover the topmost ILD film 406conformally. According to an embodiment of the present invention, thepassivation layer PL may comprise polyimide, silicon nitride, or siliconoxide.

According to an embodiment of the present invention, the passivationlayer PL covers the periphery of the aluminum pad AP and the top surfaceof the topmost ILD film 406. According to an embodiment of the presentinvention, a photolithography process and an etching process may becarried out to form an opening OB in the passivation layer PL, exposinga portion of the upper surface of the aluminum pad AP for subsequentconnection with an external circuit.

As shown in FIG. 5 , structurally, an integrated circuit device 1includes a substrate 100 and an integrated circuit area 10 on thesubstrate 100. The integrated circuit area 10 includes a dielectricstack 40. A cap layer 404 is disposed on the dielectric stack 40. A sealring 30 is disposed in the dielectric stack 40 and around a periphery ofthe integrated circuit area 10. A trench R is formed around the sealring 30 to expose a sidewall 40 a of the dielectric stack 40. Ametal-insulator-metal (MIM) capacitor 110 including a capacitor topmetal (CTM) layer 112 and a capacitor bottom metal (CBM) layer 111 isdisposed on the dielectric stack 40. A moisture blocking layer 405continuously covers the integrated circuit area 10 and the MIM capacitor110. The cap layer 404 is interposed between the CTM layer 112 and theCBM layer 111 of the MIM capacitor 110 and functions as a capacitordielectric layer of the MIM capacitor 110. The moisture blocking layer405 extends to the sidewall 40 a of the dielectric stack 40, therebysealing a boundary 402 between two adjacent dielectric films 401, 403 inthe dielectric stack 40. A passivation layer PL is disposed over themoisture blocking layer 405.

According to some embodiments, the integrated circuit area 10 comprisesa radio-frequency (RF) circuit region 11.

According to some embodiments, the substrate is a silicon-on-insulator(SOI) substrate 100 comprising a lower substrate 101, a buried oxidelayer 102 on the lower substrate 101, and a device layer 103 on theburied oxide layer 102.

According to some embodiments, the device layer 103 comprises a siliconlayer.

According to some embodiments, the seal ring 30 is electrically coupledto the lower substrate 101 with a through contact TV that penetratesthrough the device layer 103 and the buried oxide layer 102.

According to some embodiments, the two adjacent dielectric films 401,403 are two adjacent low-dielectric constant (low-k) dielectric films.

According to some embodiments, the seal ring 30 is a discontinuous sealring.

According to some embodiments, the seal ring 30 is composed ofinterconnected metal lines and vias.

According to some embodiments, the metal lines comprise a topmost coppermetal layer M2.

According to some embodiments, the topmost copper metal layer M2 is atopmost damascene copper layer, and the CBM layer 111 is coplanar withthe topmost damascene copper layer M2.

According to some embodiments, the integrated circuit device 1 furthercomprises a topmost inter-layer dielectric (ILD) film 406 covering themoisture blocking layer 405 and the MIM capacitor 110; a topmost vialayer Vn penetrating through the topmost ILD film 406 and the moistureblocking layer 405 to electrically connect with the topmost copper metallayer M2; and an aluminum pad AP disposed on and electrically connectedto the topmost via layer Vn.

According to some embodiments, the passivation layer PL covers aperiphery of the aluminum pad AP and a top surface of the topmost ILDfilm 406.

According to some embodiments, the topmost ILD film 406 comprisessilicon oxide.

According to some embodiments, the passivation layer PL comprisespolyimide or silicon oxide.

According to some embodiments, the moisture blocking layer 405 comprisessilicon nitride, silicon oxynitride, or silicon carbonitride.

Please refer to FIG. 6 to FIG. 9 . FIG. 6 to FIG. 9 are schematic,cross-sectional diagrams showing a method of fabricating an integratedcircuit device 2 with a seal ring according to another embodiment of thepresent invention. As shown in FIG. 6 , likewise, after the depositionof the cap layer 404, a patterned photoresist layer 410 is formed on thesecond metal layer M2 and the dielectric film 403. According to anembodiment of the invention, the patterned photoresist layer 410 coversthe integrated circuit area 10 and partially exposes the scribe linearea 20. Next, an anisotropic dry etching process is performed to etchaway the dielectric stack 40 that is not covered by the patternedphotoresist layer 410, partially revealing the device layer 103 in thescribe line area 20, thereby forming at least one annular trench R inthe scribe line area 20 around the periphery of the seal ring 30. Thetrench R may have a width of about 1-5 micrometers depending upon theaspect ratio of the metal stack of the seal ring 30. According to anembodiment of the invention, the trench R surrounds the seal ring 30,and the trench R exposes a sidewall 40 a of the dielectric stack 40 andthe interface or boundary 402 between the dielectric film 401 and thedielectric film 403 on the sidewall 40 a.

As shown in FIG. 7 , subsequently, the remaining photoresist layer 410is stripped off. At this point, the cap layer 404 on the dielectricstack 40 is revealed. Next, a moisture blocking layer 405 is formed tocontinuously cover the integrated circuit area 10 and extend onto thesidewall 40 a of the dielectric stack 40, thereby sealing the interface402 between the dielectric films 401 and 403 of the dielectric stack 40.The moisture blocking layer 405 can effectively prevent moisture orcontaminants from penetrating into the RF circuit region 11. Accordingto an embodiment of the invention, the moisture blocking layer 405 maycomprise silicon nitride, silicon oxynitride, or silicon carbonitride.According to an embodiment of the invention, the moisture blocking layer405 is a composite layer comprising a silicon oxide layer 405 a and asilicon nitride layer 405 b on the silicon oxide layer 405 a. Accordingto an embodiment of the invention, the moisture blocking layer 405 notonly covers the sidewall 40 a of the dielectric stack 40, but alsoextends into the scribe line region 20 and covers the device layer 103.

As shown in FIG. 8 , an anisotropical dry etching process may beperformed to etch the moisture blocking layer 405 until the cap layer404 on the dielectric stack 40 is revealed, thereby forming an annular,moisture-blocking spacer 405 s around the seal ring 30. The moistureblocking spacer 405 s covers the sidewall 40 a of the dielectric stack40.

As shown in FIG. 9 , next, an ILD film 506, such as a silicon oxidelayer, tetraethylorthosilicate glass (TEOS) oxide layer or afluorine-doped tetraethylorthosilicate glass (FTEOS) oxide layer, isformed to cover the cap layer 404 and the moisture barrier spacer 405 s.The trench R may be completely filled with the ILD film 506 and themoisture barrier spacer 405 s. A third metal layer M3 and a second vialayer V2 are formed in the ILD film 506. The second via layer V2penetrates the cap layer 404 and is coupled to the second metal layerM2. Another cap layer 604 such as a silicon nitride layer, a siliconoxynitride layer, or a silicon carbide layer may be formed on the thirdmetal layer M3 and the ILD film 506.

Subsequently, a topmost ILD film 606 is formed to cover the cap layer604. Next, a topmost via layer Vn is formed in the topmost ILD film 606.The topmost via layer Vn penetrates through the topmost ILD film 606 andthe cap layer 604 to connect with the third metal layer M3. Next, analuminum pad AP is formed on the topmost ILD film 606. The aluminum padAP is disposed directly on the topmost via layer Vn, and is electricallyconnected to the topmost via layer Vn. Next, a passivation layer PL isdeposited to cover the topmost ILD film 606 conformally. According to anembodiment of the present invention, the passivation layer PL maycomprise polyimide, silicon nitride, or silicon oxide.

According to an embodiment of the present invention, the passivationlayer PL covers the periphery of the aluminum pad AP and the top surfaceof the topmost ILD film 606. According to an embodiment of the presentinvention, a photolithography process and an etching process may becarried out to form an opening OB in the passivation layer PL, exposinga portion of the upper surface of the aluminum pad AP for subsequentconnection with an external circuit.

Those skilled in the art will readily observe that numerousmodifications and alterations of the device and method may be made whileretaining the teachings of the invention. Accordingly, the abovedisclosure should be construed as limited only by the metes and boundsof the appended claims.

What is claimed is:
 1. A method for fabricating an integrated circuitdevice, comprising: providing a substrate; forming an integrated circuitarea on the substrate, said integrated circuit area comprising adielectric stack; forming a seal ring in said dielectric stack andaround a periphery of said integrated circuit area; forming a cap layeron the dielectric stack; forming a trench around the seal ring andexposing a sidewall of said dielectric stack; forming ametal-insulator-metal (MIM) capacitor comprising a capacitor top metal(CTM) layer and a capacitor bottom metal (CBM) layer on said dielectricstack; forming a moisture blocking layer continuously covering saidintegrated circuit area and said MIM capacitor, wherein said cap layeris interposed between said CTM layer and said CBM layer of said MIMcapacitor and functions as a capacitor dielectric layer of said MIMcapacitor, and wherein said moisture blocking layer extends to saidsidewall of said dielectric stack, thereby sealing a boundary betweentwo adjacent dielectric films in said dielectric stack; and forming apassivation layer over said moisture blocking layer.
 2. The methodaccording to claim 1, wherein said integrated circuit area comprises aradio-frequency (RF) circuit region.
 3. The method according to claim 1,wherein said substrate is a silicon-on-insulator (SOI) substratecomprising a lower substrate, a buried oxide layer on the lowersubstrate, and a device layer on the buried oxide layer.
 4. The methodaccording to claim 3, wherein said device layer comprises a siliconlayer.
 5. The method according to claim 3, wherein said seal ring iselectrically coupled to said lower substrate with a through contact thatpenetrates through said device layer and said buried oxide layer.
 6. Themethod according to claim 1, wherein said two adjacent dielectric filmsare two adjacent low-dielectric constant (low-k) dielectric films. 7.The method according to claim 1, wherein said seal ring is adiscontinuous seal ring.
 8. The method according to claim 7, whereinsaid seal ring is composed of interconnected metal lines and vias. 9.The method according to claim 8, wherein said metal lines comprise atopmost copper metal layer.
 10. The method according to claim 9, whereinsaid topmost copper metal layer is a topmost damascene copper layer, andwherein said CBM layer is coplanar with the topmost damascene copperlayer.
 11. The method according to claim 10 further comprising: forminga topmost inter-layer dielectric (ILD) film covering said moistureblocking layer and said MIM capacitor; forming a topmost via layerpenetrating through said topmost ILD film and said moisture blockinglayer to electrically connect with said topmost copper metal layer; andforming an aluminum pad disposed on and electrically connected to saidtopmost via layer.
 12. The method according to claim 11, wherein saidpassivation layer covers a periphery of said aluminum pad and a topsurface of said topmost ILD film.
 13. The method according to claim 12,wherein said topmost ILD film comprises silicon oxide.
 14. The methodaccording to claim 12, wherein said passivation layer comprisespolyimide or silicon oxide.
 15. The method according to claim 1, whereinsaid moisture blocking layer comprises silicon nitride, siliconoxynitride, or silicon carbonitride.